The grain of the deposits is tighter and more uniform than that of ordinary immersion gold, and they have a low contact resistance. ENIG produces a highly solderable, tarnish-resistant surface that also delivers excellent electrical continuity. The nickel component acts as a barrier against copper diffusion and protects the solder from contamination during soldering and rework. ENIG also provides EMI protection. This final finish procedure is corrosion-resistant and provides an excellent contacting surface.
US AutomationTechnology’s ENIG technique eliminates the need for “dummy plating,” saving time and money. They also gain access to:
- A chloride-free, low-concentration, room-temperature catalyst
- A bath that is at least 10 degrees cooler than the competitors
- Compatibility with the most cutting-edge soldermask technologies
We recommend using the STARLINE DASH Controller. Self-cleaning and self-calibrating, this innovative electroless nickel controller. The controller adjusts the calibration curve to account for the accumulation of by-products and keeps a detailed record for SPC charting.
